Modelling and Simulation of Internal Traverse Grinding – from Micro-thermo-mechanical Mechanisms to Process Models

Holtermann, R.1, a; Schumann, S.2, b; Menzel, A.3, c; Biermann, D.2, d

1)
Institut für Mechanik, Technische Universität Dortmund, Leonhard-Euler-Str. 5, 44227 Dortmund
2)
Institut für Spanende Fertigung, Technische Universität Dortmund, Baroper Str. 303, 44227 Dortmund
3)
Division of Solid Mechanics, Lund University, P.O. Box 118, SE-22100 Lund, Schweden

a) raphael.holtermann@tu-dortmund.de; b) schumann@isf.de; c) andreas.menzel@udo.edu; d) biermann@isf.de

Kurzfassung

This contribution deals with the modelling and simulation of Internal Traverse Grinding (ITG) using electroplated cubic Boron Nitride (cBN) wheels. This abrasive process fulfils the industrial demands for an extensive rate of material removal along with a good surface quality while minimising the number of manufacturing processes. To overcome one drawback of ITG in terms of a highly concentrated thermal load on the workpiece surface, a multi-scale simulation framework that combines different modelling methods in a hybrid framework is presented. In this context, a geometric-kinematic simulation is combined with a finite element analysis which focuses on the thermo-mechanical response of a single cBN grain being in contact with a hardened workpiece. Via a special scale-bridging scheme, the results of both the former simulations are used to compute a thermo-mechanical load compound acting as a boundary condition in a process-scale finite element model. The latter is then used to capture thermally induced geometrical errors during ITG and to develop compensation strategies accordingly.

Schlüsselwörter

FEM simulation, Chip formation simulation, process simulation, machining error compensation, internal grinding

Veröffentlichung

Thermal Effects in Complex Machining Processes, Lecture Notes in Production Engineering, (2017), S. 369-403